| 摘要 |
PURPOSE:To obtain the title material for sealing electronic components, which is excellent in flow and gel time and can give a molding excellent in heat resistance, by mixing a specified epoxy resin with a phenolic hydroxyl group- containing compound. CONSTITUTION:A condensate of a phenol (a) with hydroxybenzaldehyde (e.g., phenol/salicylaldehyde novolak resin) is epoxidized to obtain an epoxy resin (A) represented by the formula (wherein R is H or an alkyl such as methyl, propyl or t-butyl and n>=0) and having, on the average, 4-10 benzene nuclei derived from component (a) and component (b) and a hydrolyzable chlorine content <=500ppm. Component A is mixed with 0.6-1.3, preferably, 0.9-1.1 (in terms of a ratio of the number of hydroxyl equivalents of component B to the number of epoxy equivalents of component A) of a compound (B) having at least two phenolic hydroxyl groups in the molecule (e.g., novolak phenolic resin) and, optionally, an epoxy resin other than component A, a cure accelerator, an inorganic filler, a mold release, a colorant, a coupling agent, etc.
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