| 摘要 |
<p>PURPOSE:To obtain a photocoupler having a reduced thickness, by constructing a light transmission path including a through hole provided in a first lead frame with a light-emitting element fixed thereon, a through hole provided in a second lead frame with a light-receiving element fixed thereon, and a light-transmitting insulating material. CONSTITUTION:First and second lead frames 1 and 2 having respective through holes 5A and 5B in the ends adjacent to each other are disposed on the same plane, and a lightemitting element 3 is fixed on the surface of the first lead frame so that the light-emitting surface thereof faces the through hole 5A of the first lead frame and that it covers the through hole, while a light-receiving element 4 is fixed on the surface of the second lead frame so that the light- receiving surface thereof faces the through hole 5B of the second lead frame and that it covers the through hole. A light-transmitting insulating material 7 transmitting a light is provided between the through holes so that it covers the through holes at the back of first and second lead frames. Parts of the first and second lead frames, the lightemitting element, the light-receiving element and the light-transmitting insulating material are sealed up integrally with mold resin 9. This provids a thinner structure for a photocoupler.</p> |
