| 摘要 |
PURPOSE:To obtain high superposing accuracy while suppressing a decrease in throughput as much as possible by preliminarily detecting an aligning position relative to a specified working region. CONSTITUTION:Several working regions disposed at the periphery of one working region to be worked on a substrate and presented in a smaller area than the whole working area on the substrate are preliminarily detected at aligning positions. Then, the obtained aligning positions are averaged to decide a relative positional relation between one working region to be observed and a working reference position, and a substrate to be worked is positioned on the basis of the decided positional relationship. Accordingly, the disposition of a shot region preliminarily aligned to decide the shot position is varied in response to the change of the position to be shot and exposed on a wafer in a step-and- repeat type exposure unit. Thus, even of a local arranging error exists, the shot position is determined in response to the local error. |
