| 摘要 |
A method for etching sapphire and other etch-resistant materials is disclosed. The method consists of preparing a hot, precipitated-gel form of phosphoric acid solution and immersing the item to be etched in the hot, precipitated-gel. The gel is prepared by heating a liquid phosphoric acid solution, causing water contained in the solution to evaporate. As the water evaporates, the solution thickens and eventually attains the precipitated-gel state. The etching rate of a sapphire wafer immersed in the gel is on the order of 10-50 microns per hour, depending on the depth of immersion, the orientation of the wafer and the temperature of the gel.
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