| 摘要 |
Disclosed are sockets for flat pack electronic device packages on a carrier. The socket includes a lid for receiving the carrier and the flat pack package in a loading position. The lid is rotated to a latched position so as to align each of the ribbon leads of the electronic device package with one of a plurality of contacts embedded in the base of the socket. Means are provided to automatically align the carrier and flat pack package with the socket when the carrier is loaded into the lid.
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