发明名称 Exposure method and apparatus for semiconductor fabrication equipment
摘要 An apparatus for controlling the exposure for successively exposing or printing the same pattern in the different areas on a photosensitive surface of a photosensitive substrate such as a wafer or a photographic mask. The intensity of the light projected onto the photosensitive surface from a light source through a shutter is detected in response to the full opening of the shutter. The required exposure time is computed in accordance with the detection result and a desired exposure and the closing operation of the shutter is started when there is a special relation between the measured shutter time count and the computed result. To prevent any waste of the light source, the light source performs its light emitting operation such that alternate relatively high-intensity emission and relatively low-intensity emission are periodically repeated and the average input power to the light source during the interval is maintained at a predetermined value.
申请公布号 US4712910(A) 申请公布日期 1987.12.15
申请号 US19860925487 申请日期 1986.10.29
申请人 NIPPON KOGAKU K.K. 发明人 SAKATO, KEIICHIRO
分类号 G03F7/20;H01L21/30;(IPC1-7):G03B27/72;G03B27/42 主分类号 G03F7/20
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