| 摘要 |
PURPOSE:To provide a titled photoresist which has substantial sensitivity to high-speed scanning and exposing of a visible light laser and has the excellent adhesiveness to a metallic substrate and etching resistance by forming 1st and 3rd layers of transparent high-polymer films and forming a 2nd layer of a photosensitive layer contg. a specific component. CONSTITUTION:This photoresist consists of 3 layers of the laminates having resilience. The 1st and 3rd layers thereof are formed of the transparent high- polymer films and the 2nd layer is formed of the photosensitive layer contg. the following component: A high-molecular polymer having 50-300 acid value and 10,000-500,000mol.wt., monomer having >=2 addition polymerizable ethylenic unsatd. double bonds in the molecule, the aminophenyl ketone compd. expressed by the formula and org. perester compd. having benzene skeleton or benzophenone skeleton in the molecule. The high-molecular polymer to be used refers to a vinyl addition-polymn. type polymer, etc. and is preferably a copolymer with (meth)acrylic acid. The addition polymerizable ethylenic unsatd. monomer includes, for example, a PE glycol di(meth)acrylate, etc. |
