| 摘要 |
<p>Method for sealing capsules having coaxial cap and body parts which overlap when telescopically joined, comprising the steps of: a) contacting the edge of the cap part of the capsule with a meltingpoint depression mixture comprising from about 20% to about 98% of an organic solvent or a mixture thereof being miscible with water and from about 2% to about 80% of water, to cause this mixture to be evenly distributed between the overlapping sections of the capsule body and cap parts; b) removing the melting-point depression mixture from the exposed capsule surface of said capsules; and c) heating the overlapping sections of body and cap parts to a temperature from about 40 DEG C to about 170 DEG C.</p> |
