| 摘要 |
PURPOSE:To improve packaging density and reliability, by mounting a plurality of semiconductor integrated circuits on the upper and lower surfaces of a package, and interconnecting a plurality of the semiconductor integrated circuits in the inside or on the surfaces of the package. CONSTITUTION:Semiconductor integrated circuits 1 and 2 are mounted on the front and rear surfaces of a package 3 and interconnected with a first interconnection layer 5 and a second interconnection layer 6. For example, when a multiple CPU system and the like are formed, two CPUs are mounted on the front and rear surfaces of one package and interconnected. The CPUs are soldered on a substrate. When a plurality of the semiconductor integrated circuits are mounted on the front and rear surface of one package, the packaging density becomes high at the time of substrate packaging in comparison with the case when the semiconductor integrated circuits are mounted on only the upper surface of one package. At the same time the number of parts is decreased and reliability is improved. |
