| 摘要 |
PURPOSE:To improve reliability of a product by eliminating an inside void, by a method wherein raw materials of molding resin are kneaded while a volatile ingredient and air in resin are being deaerated by fusing the raw materials by metering, mixing and heating, which is cast into a molding tool under a fused state and molded into a tablet by curing the same through cooling. CONSTITUTION:Raw materials which have been obtained through metering and mixting processes (a), (b) and mixed up evenly are mixed up so that they are turned into far uniform composition by turning into a fused state by heating them preferably for 2-3 minutes at 100 deg.C in a heating and kneading process (c), and prereacted at the same time. Then a volatile ingredient and air in resin are deaerated by deaerating equipment 5. Then a fixed quantity of resin 1 after fusion and kneading is cast in turn into a hole 2 of a tablet molding tool 3 by heating the tablet molding tool 3 preferably at 100 deg.C. At the time of completion of casting, the tool is cooled down to a room temperature and the resin is cured. The tablet 4 is taken out after cure, and provided to a resin sealing process of semiconductor equipment.
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