发明名称 RESIN COMPOSITION FOR LAMINATED SHEET
摘要 PURPOSE:To provide the title compsn. which gives a laminated sheet having excellent low-temperature punchability and mechanical strength and suitable for use as a printed circuit board for domestic electronic appliances, containing a resol type phenolic resin and an alkyd resin as essential ingredients. CONSTITUTION:A resol type phenolic resin (A) such as an alkyl-modified phenolic resin, a melamine-modified phenolic resin or a xylene-modified phenolic resin is blended with 5-50wt% (based on the amount of the compsn.) alkyd resin (B) having an oil length of 30-70%, obtd. by reacting a polybasic acid (a) such as phthalic anhydride with a polyhydric alcohol (b) such as ethylene glycol, glycerol, etc. and a fatty acid oil (c) such as tung oil, linseed oil, soybean oil, dehydrated caster oil, coconut oil, tall oil, etc.
申请公布号 JPS62285944(A) 申请公布日期 1987.12.11
申请号 JP19860128108 申请日期 1986.06.04
申请人 TOSHIBA CHEM CORP 发明人 SUZUKI TETSUAKI
分类号 C08L67/00;C08L61/04;C08L61/06;C08L61/14;C08L67/08;H05K1/03 主分类号 C08L67/00
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