发明名称 RESIN MATERIAL FOR USE IN SHEATHING ELECTRONIC COMPONENT
摘要 PURPOSE:To enable thermal conductivity to be greatly improved without detriment to electrical insulating properties, by incorporating a microballoon made of glass and enclosing a gas or a liquid having good thermal conductivity therein in an electrical insulating resin. CONSTITUTION:A microballoon made of glass, having a particle size of 1-100mu and enclosing a gas or a liquid having good thermal conductivity (e.g., Freon or silicone oil) therein is incorporated in an electrical insulating resin (e.g., an epoxy resin or a phenolic resin). Glass is an electrical insulant so that a resin material having good thermal conductivity as well as good electrical insulating properties and suitable for use in sheathing electronic components can be obtd.
申请公布号 JPS62285952(A) 申请公布日期 1987.12.11
申请号 JP19860128431 申请日期 1986.06.02
申请人 NEC CORP 发明人 HORI JINKO
分类号 C08K7/22;C08K7/16;C08L101/00 主分类号 C08K7/22
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