发明名称 HERMETIC SEAL STRUCTURE
摘要 PURPOSE:To improve the positional precision of the mounting of an element by forming a metallic outer ring by a double-layer clad material with a Cu-W material on the element mounting side and integrally shaping the Cu-W material. CONSTITUTION:A metallic outer ring 1 for fitting an element has a Cu-W material 2 on an Fe-Ni-Co material 3, an Fe-Ni material 4 or an Fe material 5, and a lead 6 is penetrated into a hole 7 and hermetically sealed with glass 12. A cover 8 is fast stuck and fixed, surrounding the Cu-W material 2 on the outer ring 1. A semiconductor element 10 is set up onto the upper surface of the Cu-W material 2, and connected 11 to the tip of the lead 6. The positional accuracy of the mounting of the element is improved because the metallic outer ring is shaped integrally on the element fitting side in the Cu-W material, and heat resistance and airtightness are not damaged and heat dissipating properties are also enhanced because a conventional material is used as the external material of the metallic outer ring.
申请公布号 JPS62285448(A) 申请公布日期 1987.12.11
申请号 JP19860129009 申请日期 1986.06.03
申请人 SHINKO ELECTRIC IND CO LTD 发明人 MIYASHITA HITOSHI
分类号 H01L23/02;H01L23/04 主分类号 H01L23/02
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