| 摘要 |
PURPOSE:To provide the title adhesive which has a low impurity content and a high strength at high temp., hardly causes lowering in strength even when cured after standing for a long period of time and has excellent quick-curability, consisting of a specified modified resin, an alicyclic epoxy resin, an aluminum compd., a silicon compd. and an electrically conductive powder. CONSTITUTION:A bismaleimide of formula I (wherein Ar1 is a bivalent arom. group) is reacted with a dicyanate of formula II (wherein Ar2 is Ar1 and a triazine resin having a cyanate group at its terminal and a triazine ring in its molecular chain, formed by the cyclic polymn. of at least 3mol of a dicyanate and represented by formula III to obtain a modified resin 60-90wt% in total of 10-90wt% component A, 90-10wt% alicyclic epoxy resin (B) which is liquid at room temp., 0.001-10wt% (based on the amount of the component B) aluminum compd. (C) (e.g., trismethoxyaluminum) and 0.05-5wt% (based on the amount of the component B) silicon compd. (D) of formula IV (wherein R<1> and R<2> are each H, a halogen, an alkyl or an aryl; n is a number of 0-4), which forms a silanol by heating, is blended with 40-10wt% electrically conductive powder (E) having an average particle size of not larger than 10mum (e.g., copper powder). |
