| 摘要 |
PURPOSE:To facilitate positioning by forming two projections on the rear of a package body and fitting the projections into through-holes in an IC substrate. CONSTITUTION:At least two projections 5 are shaped on the rear of a package body 1, and fitted into through-holes 6 in an IC substrate 3. The flat package body is positioned precisely onto the IC substrate at that time, and connecting terminals 2 can be placed accurately on each of patterns 4 for connection. Laser beams are made to go round on the package body 1 while the upper sections of the terminals 2 are irradiated with laser beams in succession, thus correctly mounting the package 1 simply onto the substrate 3.
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