发明名称 METHOD FOR MOLDING FILM AND DEVICE THEREOF
摘要 PURPOSE:To improve the accuracy in thickness of a film in its advancing direction and reduce the peeling force of the film by a method wherein, a thermoplastic resin is extruded so as to be molded in the form of a film by being cooled and solidified with a cooling drum and the peeling of the film off the cooling drum is performed under the condition that a minute high frequency vibration is applied to said film. CONSTITUTION:Because a film 6 adheres to the outer periphery of a peeling roll 30, the roll 30 rotates at the same speed as that of the film 6. Because a shaft 31 is rotated at high speed by a driving motor 35 and, in addition, slight eccentricities are provided at parts B and C, the peeling roll 30 vibrates minutely at high frequency, resulting in making the fluctuation of the peeling force of the film 6 off a cooling drum 5 small and consequently reducing the torsional vibration of the cooling drum 5.
申请公布号 JPS62284720(A) 申请公布日期 1987.12.10
申请号 JP19860129544 申请日期 1986.06.04
申请人 MITSUBISHI HEAVY IND LTD;KONICA CORP 发明人 HIDA KUNIHARU;KUSAFUKA NOBORU;TSUTSUI YOSHIMITSU;KUSHIMA TOSHIYA
分类号 B29C47/88;B29L7/00 主分类号 B29C47/88
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