| 摘要 |
PURPOSE:To enable sufficiently high accuracy and stabilized reading-out of a vigorously undulating border line, by grasping a border line of Si- and Au-surfaces of semiconducter parts, etc. as a group of border points and processing it statistically. CONSTITUTION:An image scanning circuit 14 specifies each horizontal scanning time, scanning time per a single image, etc. in a camera 13 to specify co-ordinates in the image. And, x, y co-ordinate values are produced out according to the image scanning. A binarizing circuit 15 makes binary signal conversion of Au-plating range and Si- plating range respectively among image signals from the camera 13 and their threshold value levels are located approximately in the middle of signal levels showing each range. An end point detecting circuit 16 detects that conversion was made from the Au-range to the Si-range or vice versa by an output of a circuit 15 to produce a border point pulse signal. By this arrangement, an image of the border line of the semiconductor elements is developed in such a way that it is located approximately perpendicular to the horizontal scanning direction of the camera 13 and a border point position is detected per each horizontal scanning for calculation of the co-ordinate values and an average value is obtained upon finishing of the scanning of a portion of one image and an approximately real position of the border line can be determined.
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