Electroless copper plating and bath therefor.

摘要

In the present invention electroless copper is plated from aqueous plating baths comprising a soluble copper salt, ethyleneidamine tetraacetic acid, dimethylamine borane, thiodyglycolic acid and a surfactant reaction product of ethylene oxide and an acetylenic glycol with sufficient ammonium hydroxide to adjust the pH between about 8.O and 11.5.