| 摘要 |
<p>Disclosed is a technique for providing solder bumps (15, 16, 17) to electronic components (10), such as silicon chips, chip carriers, and circuit boards, so as to achieve large stand-off heights. The component is covered with a mask (14), such as a photoresist, leaving exposed the solder pads (11, 12, 13) on the component. Solder is applied to the surface along with ultrasonic energy so that the solder wets the exposed pads. The mask acts as a mold for the solder, thereby producing. large solder bump heights.</p> |
