发明名称 RESIN-SEALED SEMICONDUCTOR DEVICE
摘要 PURPOSE:To eliminate cracks of a resin from a triangular conical part of lower four corners of a chip placing tab by forming a structure that the lower triangular conical part of the tap is treated to become obtuse angle to reduce the thermal stress of the resin applied to the conical part. CONSTITUTION:A tap lead is composed by punching a metal plate to be formed in the lead perpendicularly with respect to the surface of the plate, forming a predetermined chip placing part, mechanically polishing the triangular conical part of lower four corners of a chip plating tab 1 to form a bent part 8, then placing a chip 3 on the tab 1, electrically connecting a lead frame 2 with an electrode on the chip with fine metal wirings 4, and sealing it with resin 5. The thermal stress applied to the bent part 8 of lower four corners of the tap is reduced in solder dipping step to eliminate cracks of the resin from the bent part.
申请公布号 JPS62283648(A) 申请公布日期 1987.12.09
申请号 JP19860127580 申请日期 1986.06.02
申请人 MATSUSHITA ELECTRONICS CORP 发明人 MAEDA ITARU
分类号 H01L23/50;H01L23/28;H01L23/48 主分类号 H01L23/50
代理机构 代理人
主权项
地址