INTEGRATED CIRCUIT COOLING SYSTEM

摘要

PURPOSE:To notably add to the cooling efficiency by providing the heat dissipating surface of a heat transfer sheet with multiple heat dissipating fins to increase the contact area with refrigerant. CONSTITUTION:Within the title system, a heat dissipating fin 8 provided with an outer cylinder 8a and multiple fins 8b formed inside the cylinder 8a is arranged on a heat dissipating surface of a heat transfer sheet 5 to transfer the heat generated in an integrated circuit element 1 side to the refrigerant 3 in a chamber 10 through the intermediary of the heat dissipating fin 8. Furthermore, the multiple heat dissipating fins 8b are formed into radial shape not to deteriorate the fluidity of refrigerant so that the additional resistance to fluidity due to the provision of fins may be minimized.