| 摘要 |
PURPOSE:To suppress nonuniformity of a coating film and to contrive stabilization of the level of coating by a method wherein a resin material is circulated in such a manner that it overflows the opening part of a coating vessel 11, and an electronic part is dipped in the resin material overflowing the opening part. CONSTITUTION:A resin material 4 is circulated in such a manner that it overflows the opening part 11b of a coating vessel 11 by driving an agitator 12, and the resin material 4 is formed into a weak jet stream flowing upward. Then, semiconductor device 1 are supported by a multiple-connected jig 15, and the semiconductor devices 1 are dipped into the resin material 4 by lowering the multiple-connected jig 15. At this time, the lowering movement of the multiple-connected jig 15 is controlled by a level regulating stand 16, the depth of dipping can be kept constant. As a result, the fillers of the resin material 4 are dispersed uniformly by preventing the sedimentation of the fillers, the level of the liquid resin can be maintained by preventing the formation of a film on the surface of the liquid resin, the generated bubbles are removed, and the creeping-up property of the resin to the semiconductor device can be improved.
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