| 摘要 |
A method for the removal of sub-micron contaminant particles from a surface, such as the surface of a semiconductor wafer. The method comprises washing the contaminated surface in a cleaning solution of a high-molecular-weight highly-fluorinated organic surfactant in a non-ionic highly-fluorinated organic carrier. The surface is then rinsed with a rinsing liquid, which is also a highly-fluorinated organic liquid, and which may be the same as the carrier liquid. In a preferred embodiment, a cascade rinsing method is provided in which the rinsing liquid for each rinsing step is the effluent of the subsequent rinsing step. In a further embodiment, the rinsing liquid has a lower boiling point than the surfactant to permit regeneration of the rinsing liquid by distillation of rinse effluent.
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