| 摘要 |
PURPOSE:To connect a semiconductor chip and a mounting substrate electrically and to make it possible to align both parts highly accurately, by making a restoring force, which is yielded after the reflow of protruded electrodes, act in the direction, where the central point of the semiconductor chip and the central point of the mounting substrate substantially agree. CONSTITUTION:An arranging position of an electrode 5A of a semiconductor chip 5 is set at a position, where the electrode 5A is deviated by a specified amount alpha in the direction of the central point P1 of the semiconductor chip 5 with respect to the arranging position of an electrode 4A of a mounting substrate 4. In other words, the arranging position of the electrode 4A of the mounting substrate 4 is set at a position, where the electrode 4A is deviated in the reverse direction to the direction of the central point P1 of the semiconductor chip 5 (or the central point P2 of the mounting substrate 4) by the specified amount alpha with respect to the arranging position of the electrode 5A of the semiconductor chip 5. A protruded electrode 6, which is connected to the electrode 4A and the electrode 5A, whose arranging positions are deviated, is formed in a slant state (having an angle theta, which is formed with a horizontal plane that will be described later).
|
