DEPOSITION APPARATUS WITH AUTOMATIC CLEANING MEANS AND METHOD OF USE

摘要

A deposition apparatus (10) comprising two chambers, a reaction chamber (12) and a load lock wafer storage chamber (14) separated by a remotely controlled door (16) or access port (15). Chemical vapor deposition processing and dry etch cleaning of the reaction chamber are performed alternatively during normal operation of the deposition apparatus. Wafers on which a layer is being deposited are transportated from the load lock automatically to the reaction chamber for processing and thereafter returned to the load lock. A plurality of wafers (64) may be stored in the load lock for processing. Access to the load lock is via an external door (60) when the load lock has been backfilled to external atmosphere. Cleaning of the reaction chamber takes place during the wafer exchange time.