发明名称 ASSEMBLY DEVICE FOR SEMICONDUCTOR DEVICE
摘要 PURPOSE:To shorten the arrangement time at the time of varying kinds while removing waiting for the cooling of heater blocks by installing a plural kind of the heater blocks on the outer circumference of a rotatable block supporter and selecting a desired heater block as required. CONSTITUTION:Four flat mounting surfaces are formed on the outer circumferential surface of a block supporter 76 at regular intervals, and different heater blocks 78-81 are fitted to these mounting surfaces. When changing over kinds, a device is stopped, and the block supporter 76 is positioned at a lower section by reversely rotating a motor 72. A locating pin 86 is drawn out, the block supporter 76 is kept rotatably, a motor 83 is turned, the block supporter 76 is rotated at a fixed nagle, and a desired heater block such as one 80 is faced in front of a circuit substrate 1 and revolution is stopped. The locating pin 86 is penetrated into a pilot hole 78c at a lowermost level, a reference hole 85 and the pilot hole 78c are conformed, and the heater block 80 is adjusted at predetermined height by the motor 72, thus completing arrangement.
申请公布号 JPS62277740(A) 申请公布日期 1987.12.02
申请号 JP19860120207 申请日期 1986.05.27
申请人 TOSHIBA CORP 发明人 NEMOTO TOSHIYA;YAMAGUCHI MASAYOSHI;SUEMATSU MUTSUMI
分类号 H01L21/50 主分类号 H01L21/50
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