| 摘要 |
PURPOSE:To prevent the damage of a lead by bending the lead from an IC package at a right angle by using a roller when the lead is bent at the right angle near the leading-out section of the lead and the nose of the lead is curling- molded to an approximately semicircular shape. CONSTITUTION:The nose of an IC lead is formed to an approximately three eightth circular shape 3 through a conventional technique. A section 2 in the vicinity of the leading-out section of the IC lead is pushed and curved in an extent that the nose of the three eightth circular section is brought into contact approximately with a gripper 5 by a roller 6 from the outside of bending, gripped by grippers 5, 5'. The outside 4 of the IC lead is rolled in the rectangularly bent direction to a second roller 8 while an IC package 1 is held by second grippers 7, 7'. The IC package 1 is gripped by third grippers 9, 9', and the approximately three eightth circular lead nose section 3 is pressed in parallel with the rectangularly bent lead section 4 by a tool 11 with an approximately semicircular recessed section 12 while the rectangularly bent lead section 4 is held from the outside by grippers 10, 10' and curled to an approximately semicircular shape. |
