| 摘要 |
PURPOSE:To reduce the damage of a second plane, to improve yield and to stabilize the precision of parallelism formation with high accuracy by shaping the second plane in parallel without being brought into contact with a third plane by interposing a fluid film between the third plane parallel with a first plane and the second plane. CONSTITUTION:In parallelism formation between members such as a mask 1 and a wafer 4, the wafer 4 coated with a photo-resist is sucked and held onto a wafer chuck 5, a calibrator 10 parallel with the mask 1 is set, and the wafer 4 is pushed against the calibrator 10 and made parallel. Air is blown off from blow-off holes 11 through an air conductive hole 12 in the calibrator 10 at that time. Consequently, a fine clearance delta by an air film is formed be tween the wafer 4 and the calibrator 10, and the wafer 4 is made parallel in a noncontacting manner with the calibrator 10. Accordingly, there is no possibil ity in which the photo-resist applied onto the wafer is damaged and adheres on the calibrator and the precision of parallelism formation is deteriorated. Since the wafer chuck 5 is supported by a spherical surface, the wafer 4 can be fast stuck to the calibrator 10 by pushing.
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