| 摘要 |
PURPOSE:To obtain a prepreg for the bonding of a multi-layer printed circuit board having excellent storage stability, by compounding an epoxy resin with dicyandiamide and a specific brominated aromatic diamine, impregnating the obtained epoxy resin varnish in a substrate and drying the varnish. CONSTITUTION:The objective prepreg can be produced by compounding an epoxy resin with dicyandiamide and a brominated aromatic diamine of formula I (R1 and R2 are methyl or ethyl) (e.g. 4,4'-methylene-di-6-bromo-2-toluidine of formula II, 4,4'-methylenedi-2-ethyl-6-bromoaniline of formula III, the compound of formula IV, etc.), impregnating the obtained epoxy resin varnish in a substrate such as glass cloth and drying the varnish. The amount of dicyandiamide and aromatic diamine is preferably selected in a manner that the total active hydrogen equivalent of the components is 0.5-1.1 equivalent based on 1 equivalent of the epoxy resin.
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