发明名称 RESIN SEAL PACKAGE FOR ELECTRONIC PART
摘要 PURPOSE:To improve the adhesion of a lead frame and a sealing resin with high productivity by applying a base metal oxide film in the lead frame fast stuck to the resin through a sputtering method. CONSTITUTION:When a metallic oxide film is applied onto the surface of a base metal, it is a feature that a plurality of sputtering targets 2 can be arranged to substances to be coated 1 in three-dimensions when adopting a sputtering method. Consequently, films can be formed on the whole circumference, such as the backs and side surfaces including the surfaces of the substances to be coated, and productivity can be improved remarkably. The characteristics of the metallic oxide film can be controlled simply, and sealing properties in the same extent as or higher than an ion plating method can be realized in the same film quality as the ion plating method. An alumina film is prefrable as the metallic oxide film.
申请公布号 JPS62277758(A) 申请公布日期 1987.12.02
申请号 JP19860121885 申请日期 1986.05.27
申请人 SUMITOMO ELECTRIC IND LTD 发明人 IHARA HIROHIKO;IGARASHI TADASHI
分类号 H01L23/50;H01L21/48;H01L23/28;H01L23/495 主分类号 H01L23/50
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