| 摘要 |
PURPOSE:To obtain a one-pack type sealant containing a liquid resin obtained by dissolving a specific amount of a high-molecular-weight solid bisphenol A-type epoxy resin in a low-molecular-weight liquid epoxy resin, having high reliability, etc., as a semiconductor sealant and capable of giving a cured material having excellent gloss, etc., by sealing. CONSTITUTION:The objective one-pack type sealent is composed of (A) a liquid resin produced by dissolving 1-50wt% high-molecular weight solid bisphenol A-type epoxy resin (preferably having an average molecular weight of 1,000-3,000)in a low-molecular-weight liquid epoxy resin (preferably having an average molecular weight of 200-500) and preferably (B) a filler having an average particle diameter of 5-30mum and passing through a 150 mesh standard sieve at a yield of >=90wt% and (C) a latent curing agent, etc.
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