| 摘要 |
A multilayer wiring substrate is disclosed which includes a reconfigurable link structure for effecting wiring change. A plurality of pad portions are connected to a link structure through holes on an insulating layer located therebetween which also acts as a solder dam. A gap is present on a portion of the insulating layer through which a portion of the link structure is exposed. By cutting away the portion so exposed, the link structure is divided, and pad portions connected to the divided portions of the link structure become disconnected. An external wire may be selectively soldered to any one pad portion while the insulating layer acts as a soldering dam for preventing flow of solder onto the base wiring substrate section below the link structure. Because the insulating layer acts as a solder dam, the pad portions may be fabricated with materials conducive to solder wettability and severability.
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