| 摘要 |
<p>PURPOSE:To decrease an area of a semiconductor substrate, by forming digital circuit power-source wirings between a bonding pad for an analog circuit power supply and an end part of the semiconductor substrate. CONSTITUTION:A digital circuit 2 and an analog circuit 3 are formed in the central part of a semiconductor substrate 1, and a pair of power-source wirings 4a and 4b for the digital circuit 2 are formed among the digital circuit 2, the analog circuit 3, and the end part of the substrate 1. The part 4c of the power- source wiring 4b, facing to the circuit 3, is small in width compared with the other part over the length corresponding to the width of the analog circuit 3. The power-source wiring 4a is bent in a direction of power-source wiring 4b side at its part 4d neighboring to the part 4c small in width, resulting in that the part 4d becomes nearer to the wiring 4b than the other part. The area of the semiconductor substrate 1 can be hence decreased.</p> |
