| 摘要 |
PURPOSE:To make the flowing region of coating material before its solidification and the covering region of the coating material uniform by a method wherein conductive layers are provided so as to almost surround the circumference of a device hole with predetermined gaps and the gaps are utilized as barriers. CONSTITUTION:If conductive layers 6A-6F are patterned so as to almost surround the circumference of a device hole 3 with predetermined gaps G1, the steps 11 are formed by the conductive layers 6A-6F and the surface of a carrier tape 1. When the surface of a semiconductor chip 4 which is bonded to lead terminals 8 and 9 is covered with coating material 12 such as resin, the flowing region of the coating material 12 is restricted by the steps 11 which serve as barriers. Then, only a space surrounded by the steps 11 is filled with the coating material 12 to cover the semiconductor chip 4 and its surroundings with the coating material 12 completely. With this constitution, the covered regions by the coating material can be made to be uniform and the variation of the thicknesses of the coating film thicknesses among the carrier tape devices can be minimized. |
