Method for producing a package for a semiconductor device

摘要

A package for a semiconductor device comprising three laminated ceramic sheets: a first sheet provided with a chip stage on the upper surface thereof, a second sheet provided with a first chip-inserting window for exposing the surface of the chip stage and provided with an internal conductor pattern formed at least on the upper surface thereof; and a third sheet provided with a second window for exposing the first chip-inserting window and for exposing a wire-bonding area located adjacent to the periphery of the first chip-inserting window, characterized in that marks for recognizing the location of the first chip-inserting window are essentially aligned, this alignment being effected in that the first chip-inserting window and marks for recognizing the location of the first chip-inserting window are simultaneously formed with the same mold, the marks for recognizing the location of the first chip-inserting window being formed in the wire-bonding area of the second green sheet.