| 摘要 |
PURPOSE:To decrease thermal resistance, by supporting a heat-conductive block elastic material between a semiconductor element and a cap. CONSTITUTION:In a plastic type pin grid-arrayed package in which a semiconductor element 4 is fixed on a resinous substrate 1 with external connection terminals 2 disposed vertically and is sealed by silicone gel 8 and besides a cap 9 is mounted on a dam 7, a heat-conductive block elastic material 11 is supported between the element 4 and the cap 9. Especially when a gap (an air layer) 12 exists between the silicone gel 8 and the cap 9, such support of the heat-conductive block elastic material 11 enables thermal resistance to be decreased. |
