发明名称 BONDING APPARATUS
摘要 PURPOSE:To avoid oxidization of an object to be bonded by a method wherein the object to be bonded is covered by a fixed cover and gas is supplied to the inside of the fixed cover. CONSTITUTION:If a group of lead frames 3 which are arranged in one row along the before-and-behind direction is aligned in the hollow part of a lead frame pressing member 20, a multi-lead frame 3A is stopped intermittently. Then, if the lead frame pressing member 20 is descended to press the outer circumferential parts of the respective groups of the lead frames 3, as reductive gas is being spouted out from a group of spouting outlets 23, the lead frames 3 are exposed in a reductive gas atmosphere. At that time, as the reductive gas atmosphere is covered by a fixed cover 18 and a movable cover 24, the atmosphere can be formed efficiently. It is to be noted that, although the small window 27 of the movable cover 24 is aligned directly above the lead frame 3 to be bonded first and opened, as the opening area is small, the leakage of the gas through the small window can be minimized.
申请公布号 JPS62276840(A) 申请公布日期 1987.12.01
申请号 JP19860119227 申请日期 1986.05.26
申请人 HITACHI LTD 发明人 NAKAJIMA MAKOTO;CHUMA TOSHIO;OHASHI YOSHIO;HATORI KAZUO
分类号 H01L21/60 主分类号 H01L21/60
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