摘要 |
PURPOSE:To reduce electrostatic breakdown, by equipping a positioning part, which is made to adhere to one main surface of an electronic device package capable of being freely assembled/disassembled, and a conductor, one part of which is connected with the positioning part and the other part of which is brought in contact with external connection terminals in the electronic device. CONSTITUTION:A positioning part 2 is formed of a flat plate adhesive tape or the like so that it is formed in conformity with a shape of an IC package 12. An elastic and conductible material such as a sponge containing carbon or the like is formed into a frame shape capable of being in contact with external connection terminals 13, so that an electronic device protective tool 1 nearly of a liquid measure shape is formed of the positioning part 2 and the conductor 3. In incorporating an electronic device 11 with it, the frame-shaped conductor 3 is coupled with the package 12 so that it can be brought in contact with the external connection terminals 13 in the electronic device 11 and the positioning part 2 can be made to adhere with adhesive force to one main surface of the package 12. The external connection terminals 13 of the electronic device 11 are thus kept equipotential through the conductor. 3, and hence no potential difference due to static electricity occurs to reduce electrostatic breakdown of the electronic device 11. |