| 摘要 |
<p>A swellant and etch procedure to enhance the adhesiveness of metal coatings on resins (plastics) such as polyetherimide is provided using specially formulated compositions and operating parameters. The method includes first exposing the resin for a suitable time (e.g. 1-60 min., preferably 2-20 min.) to a swellant composition comprising a solution of a polar material, preferably having a dielectric constant greater than about 15 and a dipole moment greater than about 3 Debye Units (e.g. dimethylsulfoxide, dimethylformamide, N-methylpyrrolidone or mixtures thereof) and an organic solvent such as carboxylic acid, ketones, hydrocarbons, ethers, esters, alcohols, or polyhydrics (e.g. glycols and polyglycols including ethers and esters thereof). The swelled resin is then exposed to an etchant comprising chromium ions, and, preferably, also including an acid such as H2SO4, at an elevated temperature (e.g. above about 71<o>C) for a sufficient period to etch the swelled surface without unduly weakening or adversely affecting the physical characteristics of the resin.</p> |
