| 摘要 |
PURPOSE:To avoid the direct irradiation of a semiconductor element with electromagnetic wave energy by covering the upper surface of a semiconductor substrate wherein the element is formed with a grounded conductive layer. CONSTITUTION:The upper surface of an insulation film 3 coating the substrate 1 is further covered with an Al layer 10, which is then grounded. When the upper surface except the lead-out part with a bonding wire 5 is thus covered with the conductive layer made of the layer 10, it becomes as if the element became contained in a shielding box because of the grounded substrate 1 at the bottom, and accordingly the radiation of electromagnetic wave can be shielded. |
