发明名称 BONDING
摘要 PURPOSE:To bond a polar group-containing thermoplastic resin film to an ethylene/unsaturated ester copolymer film without using any adhesive, by subjecting the bonding surface of each film to corona discharge treatment and heating each surface to a specified temperature. CONSTITUTION:The bonding surface of each of a polar group-containing thermoplastic resin film (A) (e.g., polyester film) and an ethylene/unsaturated ester copolymer film (e.g., ethylene/vinyl acetate copolymer film) which is a copolymer (B) of ethylene with a vinyl ester or an unsaturated carboxylic acid produced by a high-pressure radical polymerization process is subjected to corona discharge treatment, and components A and B are bonded together by heating at a temperature of from the m.p. of component B to the m.p. of component A.
申请公布号 JPS62275134(A) 申请公布日期 1987.11.30
申请号 JP19860308882 申请日期 1986.12.26
申请人 TOSOH CORP 发明人 FUKUSHIMA MIKIO;SATO SHINICHI;SHIMIZU RYOICHI;FUJIMOTO SHOZO;NIIHARA HIDEO
分类号 C08J5/12;B29C59/10;B29C65/00;B29C65/02;B29K67/00;B32B27/28 主分类号 C08J5/12
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