| 摘要 |
PURPOSE:To provide an electrically conductive resin paste comprising a specific resin, a hardener and a conductive filler and excellent in reliability without causing cracking even when formed into a large chip. CONSTITUTION:One epoxy equivalent of an epoxy resin having at least 2 epoxy groups in a molecule and 0.01-0.5 carboxylic acid equivalents of a butadiene homopolymer or copolymer having carboxylic acid end groups are reacted in the presence or absence of a catalyst (e.g., N,N-dimethylbenzylamine) at a temperature of 80-160 deg.C for 0.5-5hr to obtain a resin (A). Subsequently the component A, a hardener (B) (e.g., phenol resin), a conductive filler (C) (e.g., powdered silver) being 60-95wt% of the component A and, if necessary, a solvent (D) having a boiling point of 100 deg.C or above (e.g., ethylcellosolve), an adhesion improver (e.g., silane coupling agent), a wetting improver (e.g., nonionic surfactant) etc., are kneaded.
|
