| 摘要 |
PURPOSE:To attain both high integration and high density of a magnetic bubble element by adding a bonding pad to the side face of the bubble element and therefore reducing the occupation area of the bonding pad on the surface area of the bubble element. CONSTITUTION:The bonding pads 1 are provided to all four side faces of a magnetic bubble element so as to use these many pads 1. Wirings 2 are extended up to the end parts of the bubble element for connection to those pads 1. In such a way, the pads 1 are removed out of the surface of the bubble elements to reduce the area occupied by pads 1 on the surface of the bubble element. Thus it is possible to avoid the increase of useless areas uncontributive to storage and therefore the size of the bubble element can be reduced to reduce the cost.
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