| 摘要 |
PURPOSE:To prevent the quick decrease in temperature in a furnace when wafers, a conveying jig and the like are conveyed into the core pipe in the furnace, by approaching the temperature of a containing jig to the temperature of an atmosphere on the side of the conveying direction by a temperature changing means. CONSTITUTION:A wafer supporting boat 21, on which many semiconductor wafers 20 are aligned, is mounted on arms 1. Before the wafer supporting boat 21 under this 5 tate is conveyed into a cord pipe 4 in a furnace, a heater 14 is heated by a power control device 17. The temperature of the wafer supporting boat 21 is increased through the arms 1. A cantilever part 3 is made to advance to the side of the core pipe 4 of the furnace along a guide rail 5 The wafer supporting boat 21 is conveyed in the core pipe 4 of the furnace. When the wafer supporting boat 21 is taken out of the core pipe 4 of the furnace after the heating process of the semiconductor wafer 20, cooling gas is sent to the arms 1 after the boat is taken out, and the wafer supporting boat 21 is forcibly cooled through the arms 1. A controller 15 increases the temperature and performs cooling in accordance with the predetermined temperature program.
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