| 摘要 |
PURPOSE:To make the configuration compact, to reduce the cost and to make it possble to rewrite programs readily, by mounting an UV-EP ROM (ultraviolet-ray erasing type programmable ROM) IC and another IC such as a CPU by a COB (Chip On Board) method, and sealing the UV-EP ROM IC with an ultraviolet-ray transmitting resin. CONSTITUTION:An UV-EP ROM IC 5 undergoes COB mounting. An IC chip 6 other than the UV-EP ROM, which is sealed with an ultraviolet-ray transmitting resin 1, also undergoes COB mounting. The chip 6 is sealed with an ordinary molding resin 3. After the UV-EP ROM IC 5 is erased by ultraviolet rays, a switch 3 is opened, and the IC is separated from other electric circuits. A writing device is connected to writing terminals 1, and a program is inputted to the UV-EP ROM. After writing, the switch 3 is closed again and the IC is connected to the other electric circuits. The IC can be operated as a part of the entire circuit board. The switch 3 can be either a mechanical switch or electric contacts such as an analog switch. |
