| 摘要 |
PURPOSE:To suppress breakdowon of a chip or occurrence of cracks in resin, by providing an inner wall for limiting the injecting amount of the resin at a separate position from the side frame of a container, making the wall thickness thinner than the side frame and uniform, thereby reducing the drag against the stress due to the contraction of the injected resin or heat cycle, and reducing the stress, which is applied to the resin and a semiconductor chip. CONSTITUTION:An inner wall 11 is formed, so that its entire outer surface is separated from a side frame 7. The wall 11 is linked to the side frame 7 only through a bottom part 12. Said linking part 12 can be a part, which links only a part of the inner wall 11 to the side frame 7. The side frame 7, which is provided with the inner wall 11 like this, is fixed to a metallic bottom plate 6 with a bonding agent 55. At this time, the linking part 12 is also tightly contacted with the bottom plate. A semiconductor chip is fixed on the bottom plate so that the chip is contained in a part 10 surrounded by the inner wall 11. A resin is injected so as to fill this part 10. The inner wall has a thickness (t) which is thinner than the thickness of the side wall 7. It is desirable that the thickness (t) is less than 2 nm. A height (h) is determined at the minimum height so that the semiconductor chip is hidden and moisture resistance is secured. |
