| 摘要 |
PURPOSE:To improve the water resistance of electronic device as well as the adhesive property between a sealing body and heat dissipating plates while expanding the surface area of heat dissipating plates by a method wherein fine rugged parts are formed on the positions where the heat dissipating plates formed into one body with a semiconductor chip fixing tab are brought into contact with the sealing body. CONSTITUTION:The sectional surface of rugged parts 5a, 5b are formed into fine irregularities. When these rugged parts 5a, 5b are sealed up in a sealing body 11, the resin material used as the sealing body 11 permeates into the rugged parts 5a, 5b so that the adhesive property of both parts 5a, 5b may be improved while expanding the surface area of heat dissipating plates 3a, 3b. Resultantly, any water content entering in the arrow C direction can hardly reach a semiconductor chip due to the improved adhesive property of rugged parts 5a, 5b as well as the expanded distance of water permeating channel by the rugged part 5a. |
