发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To prevent a lead shortage from occuring by means of providing a lead pin made of a shape memorizing alloy. CONSTITUTION:A lead pin 2 is made of a shape memory alloy. When the lead pin 2 brazed with a brazing material 3 is subjected to any bent, it can be reset to the original state by heating process to settle the problem of pin bending. At this time, the pin can be reset to the original (normal) pin shape due to the shape memorizing effect of the pin through a heat treatment such as aging process. Furthermore, a lead short can be prevented from occuring since the problem of pin bending is already settled.
申请公布号 JPS62274759(A) 申请公布日期 1987.11.28
申请号 JP19860117370 申请日期 1986.05.23
申请人 HITACHI VLSI ENG CORP;HITACHI LTD 发明人 SAKAGUCHI MASAHIRO;OBARA TETSUJI
分类号 H01L23/50;H01L23/49;H01L23/498;H05K1/18 主分类号 H01L23/50
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