| 摘要 |
A decoupling capacitor and method of manufacture thereof are presented wherein the decoupling capacitor is formed and consists of a molded housing with integrally molded recesses for a capacitive ceramic chip. The housing also is formed with integrally molded recesses and stabilizing tabs for active pins; and either molded recesses and stabilizing tabs for dummy pins, or molded lugs in lieu of dummy pins. |
