发明名称 PHOTO-SETTING RESIST RESIN COMPOSITION FOR ELECTROLESS PLATING
摘要 PURPOSE:The titled resin composition, containing a specific epoxy resin, radically polymerizable compound and specific photosensitive aromatic onium salt and having printability, e.g. feathering, resolution, etc., resistance to plating solution, staining therewith, etc. CONSTITUTION:A composition, containing (A) an epoxy resin having at least 2 glycidyl ether groups directly linked to the aromatic ring or cyclohexane ring in one molecule, (B) a radically polymerizable compound having at least 2 ethylenically unsaturated bonds in one molecule having <=1,000 molecular weight, e.g. ethylene glycol di(meth)acrylate, etc., and (C) a photosensitive aromatic onium salt, e.g. triphenylphenacyl phosphonium tetrafluoroborate, etc. The amounts of the components based on 100pts.wt. total of the components (A) and (B) are preferably 90-40pts.wt. component (A) and 0.1-5pts.wt. component (C).
申请公布号 JPS62273221(A) 申请公布日期 1987.11.27
申请号 JP19860115140 申请日期 1986.05.20
申请人 NIPPON SODA CO LTD;HITACHI LTD 发明人 OZAKI KIYOSHI;MORI ATSUSHI;TSUDA HIDEO;KAWAMOTO MINEO;MURAKAMI KANJI;WAJIMA MOTOYO
分类号 G03F7/038;C08G59/00;C08G59/18;C08G59/40;C08L63/00;G03F7/032;H05K3/00;H05K3/18 主分类号 G03F7/038
代理机构 代理人
主权项
地址